The semiconductor industry is entering an unprecedented 'mega-cycle' with the rapid advancement of Artificial Intelligence (AI). At the heart of this transformation lies next-generation semiconductor material technology, capable of overcoming the limits of miniaturization and maximizing performance. SEMICON Korea 2026, recently concluded with great success at COEX, Seoul, presented the future direction of the semiconductor industry and showcased a wide array of innovative material technologies. This event focused on key solutions poised to usher in the 'Angstrom Era' of semiconductor technology, ranging from AI-driven material development and atomic-level control to advanced packaging.
The advancement of AI technology demands higher performance and efficiency, which in turn is driving innovation in semiconductor material technology. The 'Advanced Materials and Process Technology' session at SEMICON Korea 2026 presented AI-driven material development as a transformative solution for next-generation computing. This signifies not just an improvement in existing material performance, but also AI acting as a key driver accelerating the discovery and optimization of new materials, thereby advancing the semiconductor industry's roadmap. Furthermore, major companies like Samsung Electronics and SK Hynix highlighted High Bandwidth Memory (HBM), crucial for AI accelerators, and next-generation advanced packaging technologies as key discussion points, emphasizing the importance of related material technologies.
Semiconductor miniaturization is reaching its physical limits, increasing the importance of new lithography and etching technologies and the materials required for them. Fujifilm showcased a broad portfolio of semiconductor materials at SEMICON Korea 2026, including advanced photoresists for EUV (Extreme Ultraviolet), ArF (Argon Fluoride), and KrF (Krypton Fluoride), as well as PFAS-free (Per- and Polyfluoroalkyl Substances-free) resists and nanoimprint resists. In particular, atomic-level precision process control technology was highlighted as an essential element for overcoming physical scaling limitations and realizing next-generation devices. These advanced materials play a critical role in forming finer and more complex circuit patterns.
The performance of semiconductor chips can no longer be solely enhanced by miniaturization within a single chip. To address this, advanced packaging and innovative interconnect technologies are gaining attention, driving active development of new materials. Fujifilm presented advanced packaging materials, including polyimides and thermal management materials under the ZEMATES™ brand, offering solutions that contribute to improving the reliability of semiconductor packages. Additionally, technical challenges related to the expansion of 3D-NAND technology were discussed, which are essential for realizing high-performance computing and memory solutions. Such diverse material innovations are paving the way for increased integration and higher performance.
In the field of power semiconductors, wide bandgap (WBG) materials, which surpass the limitations of existing silicon (Si) based technologies, are emerging as the next-generation solution. The 'Compound Power Semiconductor Summit' at SEMICON Korea 2026 illuminated the entire value chain of WBG semiconductors. Gallium Nitride (GaN) semiconductors, in particular, offer superior heat resistance and durability compared to silicon and enable high-density integration, facilitating both miniaturization and high performance for chips essential in applications like robotic joints. WBG materials like GaN are expected to drive innovation in various fields requiring high-efficiency power conversion, such as electric vehicles, fast chargers, and data centers.
SEMICON Korea 2026 featured key players from the global semiconductor ecosystem, including Imec, IBM, Merck, SK Hynix, Samsung Electronics, Fujifilm, Applied Materials, Lam Research, Tokyo Electron, and KLA, showcasing the latest material technologies and solutions. These companies presented the future direction of technology in the new industrial paradigm led by AI and emphasized the importance of collaboration and joint roadmap development that breaks down boundaries between processes and technologies. Notably, the event provided an opportunity for domestic material, component, and equipment (MCE) companies to enhance their technological capabilities through collaboration with global corporations.
SEMICON Korea 2026 clearly demonstrated the new challenges and opportunities facing the semiconductor industry with the advent of the AI era. Next-generation semiconductor material technology is unequivocally the core driver for overcoming miniaturization limits, realizing high-performance and high-efficiency semiconductors, and ultimately enabling AI-driven innovation. Innovations in areas such as AI-driven material development, advanced lithography and packaging materials, and wide bandgap semiconductors will continue to drive the sustainable growth of the semiconductor industry. Through close collaboration and continuous research and development by global companies, we can anticipate a future transformed by even more advanced semiconductor technologies.
Q1: What were the most notable next-generation semiconductor material technologies highlighted at SEMICON Korea 2026?
A1: Key topics included AI-driven material development, advanced lithography photoresists (EUV, PFAS-free, etc.), new materials for advanced packaging (polyimides, thermal management materials), and wide bandgap (WBG) power semiconductor materials like Gallium Nitride (GaN).
Q2: How does AI influence the development of semiconductor material technologies?
A2: AI accelerates the discovery and optimization processes for new semiconductor materials and enables precise atomic-level process control, playing a crucial role in overcoming miniaturization limits and realizing next-generation computing solutions.
Q3: What are the main advantages of wide bandgap (WBG) semiconductor materials, and where are they used?
A3: WBG materials like GaN offer superior heat resistance, durability, and high-density integration capabilities compared to conventional silicon. This enables miniaturization and high performance of chips in applications requiring high-efficiency power conversion, such as electric vehicles, fast chargers, data centers, and robots.
Q4: Which key companies led material technology innovation at SEMICON Korea 2026?
A4: Global semiconductor material, equipment, and chip manufacturers including Imec, IBM, Merck, SK Hynix, Samsung Electronics, Fujifilm, Applied Materials, Lam Research, Tokyo Electron, and KLA participated, showcasing various innovative technologies.
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